Advanced Level Training - 2 days (16 hours)

About Ansys Mechanical Electronics Simulation Applications Training by CADIT

Use Ansys Mechanical for semiconductor and electronics simulation — stress, thermal, vibration and packaging challenges such as warpage, wafer handling and solder joint fatigue — with trace mapping, submodelling and element birth/death techniques.

Perfect for Engineers in the semiconductor and electronics packaging industry.

Learning Outcomes

By the end of this training, you will be able to:
1. Apply Ansys Mechanical to solve common semiconductor industry analysis challenges.
2. Execute simulations using Element Birth and Death to model manufacturing processes.
3. Use submodeling techniques in warpage analysis to improve efficiency and accuracy.
4. Generate mapped and structural hexahedral meshes for models.
5. Model circuits efficiently and accurately.
6. Parameterize simulations to perform DOE and optimize designs.
7. Apply Trace Mapping and Trace Reinforcement techniques for IC/PCB modeling.

Course Content

1. Circuit Modelling — Trace Mapping and Trace Reinforcement Process
   - Workshop: ECAD data mapping
   - Workshop: Trace Reinforcement Process
   2. Stacker Mesh: Advanced Meshing Process
   - Workshop: PCB assembly part
   3. Parametric Solutions: Design Point Tables, Input vs Output Parameters
   - Workshop: Globe valve associativity and parameter setup
   4. Submodelling with Element Birth and Death, Preventing Singular Matrix
   - Workshop: Multi-level dielectric modelling, submodelling techniques and solder ball stress-strain analysis

HRDCorp Claimable Ansys Mechanical course

Certificate of completion provided. If based in Malaysia, this course can be reimbursed with the HRDCorp Program through our certified trainers.