IC HFSS Ansys

Ansys HFSS-IC - IC to System Electromagnetic Simulation Software

Ansys HFSS-IC is a unified platform for signal and power integrity analysis of IC-to-system designs, including RFICs, 3D-ICs and advanced packaging. It brings three electromagnetic solvers, HFSS, RaptorX and Q3D Extractor, together with circuit simulation in one environment, so IC and package teams can co-design and co-simulate instead of passing files between tools.

Foundry-certified extraction and HFSS accuracy support sign-off of chip, interposer, package and board assemblies.

Ansys HFSS-IC 2026 R1

• HFSS-PI: integriti kuasa 3D jalur lebar berfideliti tinggi untuk pengesahan PDN IC, pakej dan papan.
• Mod IC dan Umum: HFSS-PI berjalan dalam kedua-dua mod IC dan Umum bagi HFSS 3D Layout .
• Sapuan PI dan pemprosesan pasca lapangan (beta): sapuan PI dan plot lapangan yang dipertingkatkan untuk keputusan HFSS-PI.

Baca lebih lanjut: Apa yang Baharu dalam Ansys Electronics Desktop 2026 R1 (PDF)

HFSS, RaptorX and Q3D in One Design Environment

HFSS provides 3D electromagnetic accuracy, RaptorX fast foundry-certified IC extraction, and Q3D rapid RLCG model extraction. An IC design mode in Electronics Desktop automates translation and simplification of die and interposer designs, from DC to high frequency.

Power Integrity for Advanced Packaging

Broadband 3D power integrity analysis covers IC, package and board power delivery networks, including advanced packaging such as InFO, CoWoS and wafer-on-wafer, to predict IR drop, impedance, resonances and coupling paths.

Interposer and Chip-to-System Sign-Off

Interposers relay signals from die to die and power from package to die. HFSS-IC helps get them right the first time and supports sign-off of the complete chip-to-system assembly.

Common IC and Packaging Consultation Topics

• Interposer and package signal integrity: loss and crosstalk through interposers and packages.
• Power delivery networks: IR drop and impedance from die to board.
• RFIC passives: inductor, transformer and interconnect extraction.
• 3D-IC assemblies: die-to-die coupling.

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Produk Berkaitan

• Ansys HFSS: 3D electromagnetics for components, boards and systems.
• Ansys Q3D Extractor: RLCG extraction, one of the three solvers in HFSS-IC.
• Ansys SIwave: layout-based PCB and package SI and PI.

Ansys HFSS-IC Training Courses

• EMHF 204 - Latihan Alur Kerja Import GDS & Susun Atur 3D Ansys HFSS

See all CADIT training courses

Kemas kini Okt '26 oleh Pasukan Elektronik CADIT.