Keep Your Electronics Cool: Introduction to Ansys Icepak
Featuring
Is overheating the hidden risk in your electronics design?
From chip-level and PCB package to server racks and data centers, heat is one of the biggest threats to the performance and lifespan of electronic products. Finding thermal problems after building a prototype is slow and costly. Finding them before is where simulation helps.
Join us for a 1-hour webinar introducing Ansys Icepak, the electronics cooling solution built on the trusted Ansys Fluent solver. You'll see how engineers predict airflow and temperatures at every scale, from a single chip to a complete system.
What You'll Learn
- What Icepak is and what problems it helps solve
- Where it's used: chips, circuit boards, devices, server racks, and even data centers
- How it works in simple terms: build a model, run the simulation, and see airflow and temperature results
- What the results look like: colorful temperature maps and airflow animations that make heat visible
- How Icepak fits with other Ansys tools for structural, electromagnetic, and reliability studies
- What's new in the 2026 R1 release: major speed and productivity gains, new interface and tools
Target Audience
Anyone curious about thermal simulation, especially electrical engineers, designers, R&D teams, researchers, students, and decision-makers. Existing Icepak users are welcome too, to catch up on the latest release.
Presenter
Dr. Pannasit Borwornpiyawat, Senior Applications Engineer (CFD) & Business Development
Dr. Pannasit Borwornpiyawat is a senior application engineer at CAD-IT Consultants (Asia) Pte. Ltd., specialising in computational fluid dynamics (CFD) simulation focusing on Heating, Ventilation, and Air Conditioning (HVAC) systems, Built-Environment and Construction, Thermal Management for Electronics Devices, Industrial Equipment and much more. He also engages in business development activities for both academic and commercial customers.
