Ansys HFSS IC

Ansys HFSS-IC - IC to System Electromagnetic Simulation Software

Ansys HFSS-IC is a unified platform for signal and power integrity analysis of IC-to-system designs, including RFICs, 3D-ICs and advanced packaging. It brings three electromagnetic solvers, HFSS, RaptorX and Q3D Extractor, together with circuit simulation in one environment, so IC and package teams can co-design and co-simulate instead of passing files between tools.

Foundry-certified extraction and HFSS accuracy support sign-off of chip, interposer, package and board assemblies.

Ansys HFSS-IC 2026 R1

• HFSS-PI: high-fidelity broadband 3D power integrity for IC, package and board PDN signoff.
• IC and General modes: HFSS-PI runs in both the IC and General modes of HFSS 3D Layout.
• PI sweep and field post-processing (beta): an enhanced PI sweep and field plots for HFSS-PI results.

Read more: What's New in Ansys Electronics Desktop 2026 R1 (PDF)

HFSS, RaptorX and Q3D in One Design Environment

HFSS provides 3D electromagnetic accuracy, RaptorX fast foundry-certified IC extraction, and Q3D rapid RLCG model extraction. An IC design mode in Electronics Desktop automates translation and simplification of die and interposer designs, from DC to high frequency.

Power Integrity for Advanced Packaging

Broadband 3D power integrity analysis covers IC, package and board power delivery networks, including advanced packaging such as InFO, CoWoS and wafer-on-wafer, to predict IR drop, impedance, resonances and coupling paths.

Interposer and Chip-to-System Sign-Off

Interposers relay signals from die to die and power from package to die. HFSS-IC helps get them right the first time and supports sign-off of the complete chip-to-system assembly.

Common IC and Packaging Consultation Topics

• Interposer and package signal integrity: loss and crosstalk through interposers and packages.
• Power delivery networks: IR drop and impedance from die to board.
• RFIC passives: inductor, transformer and interconnect extraction.
• 3D-IC assemblies: die-to-die coupling.

Have a project outside this list? Send us the specification. Where a study needs specialist knowledge, we draw on our wider Ansys partner network.

Related Products

• Ansys HFSS: 3D electromagnetics for components, boards and systems.
• Ansys Q3D Extractor: RLCG extraction, one of the three solvers in HFSS-IC.
• Ansys SIwave: layout-based PCB and package SI and PI.

Related CADIT Training

• EMHF 204 - Ansys HFSS 3D Layout & GDS Import Workflow Training

Oct ’26 update by the CADIT Electronics Team.