Ansys Icepak

Ansys Icepak - Enterprise Electronics Cooling Simulation Software

Ansys Icepak is electronics cooling simulation software. Built on the Ansys Fluent CFD solver, it predicts airflow, temperature and heat transfer in and around electronic equipment, so hot spots are identified and resolved while the design is still in development.

Icepak scales from a single IC package to a PCB, an enclosure, a server rack and an entire data centre, and it runs inside Ansys Electronics Desktop alongside the electromagnetic tools.

Ansys Icepak 2026 R1

• Faster workflow: parallelised post-processing, clearer CTM visualisation, part suppression and coordinate snapping.
• Meshing and physics: improved mesh fusion and a native CPU/GPU Joule heating solver (beta).
• System Level Thermal Management: STM set-up is 3-5x quicker with 80% fewer clicks.

Read more: Ansys Icepak 2026 R1 highlights

Ansys Electronics Enterprise

The complete Ansys electronics portfolio in a single-user licence: every capability of Electronics Premium and Electronics Pro 2D, plus the advanced and coupled multiphysics tools, such as HFSS and Icepak electrothermal simulation.

Ansys Electronics Premium Icepak

All Icepak solvers, Mechanical thermal and modal solvers, ECAD and MCAD modelling and translation, and advanced circuit analysis, with Electronics Pro 2D included.

Ansys Electronics Pro 2D

2D low-frequency electromagnetic and electromechanical analysis, 2D parameter extraction, RF interference analysis and circuit simulation, including Maxwell 2D, RMxprt, PExprt and the 2D Extractor.

Fan, Heat Sink and Enclosure Cooling Design

Fans, heat sinks, vents and cold plates can be compared before a prototype exists. Icepak covers conduction, convection and radiation, checks component temperatures against their limits, and uses body-fitted meshing so real geometry is represented without excessive simplification. An extensive library of fans, heat sinks and materials shortens model set-up.

PCB and Package Thermal Modelling from ECAD

Board and package models import directly from ECAD and MCAD, with CAD healing, simplification and metal-fraction methods representing copper and vias accurately. Power dissipation maps from SIwave drive the thermal model.

Thermo-Mechanical Stress and Solder Fatigue Links

Temperatures from Icepak feed thermo-mechanical stress analysis in Ansys Mechanical and solder joint fatigue assessment in Ansys Sherlock, linking cooling design to product life.

Rack and Room-Level Data Centre Cooling

Rack- and room-level airflow determines how much IT load a hall can carry safely. Our AI Data Centre Digital Twin builds on this class of simulation.

Common Thermal Management Consultation Topics

• Enclosure cooling: fan, vent and heat sink layout for electronic equipment.
• PCB thermal analysis: board hot spots and component temperatures.
• Power electronics cooling: inverters, converters and battery management systems.
• Server rack and room airflow: rack-level and room-level cooling layouts.
• Outdoor enclosures: solar loading and temperatures in sealed equipment.

Have a project outside this list? Send us the specification. Where a study needs specialist knowledge, we draw on our wider Ansys partner network.

Related Products

• Ansys Fluent: the general-purpose CFD solver Icepak is built on, for broader flow problems.
• Ansys SIwave: PCB power integrity; supplies the power maps for board thermal analysis.
• Ansys Sherlock: solder joint and PCB reliability using Icepak temperatures.
• Ansys Discovery: early concept cooling studies that hand over to Icepak in one click.

Ansys Icepak FAQ

Can Icepak model liquid cooling?

Yes. Cold plates and liquid loops can be modelled alongside air cooling.

Related CADIT Training

• EMLF 206 - Ansys Electronics Suite Electronic Transformers Training

Oct ’26 update by the CADIT Electronics Team.